A Brief On High Density Interface
A high density interface can be advantageous for productivity but can also create a hill to climb. When information density is poorly xecuted, it can cause cognitive load and analysis paralysis, making tasks feel clumsy and cumbersome. This can negatively impact productivity and increase the risk of abandonment.
Component density
High component density interfaces make large amounts of information easy to read. The sizing of individual components can be changed to improve readability and user experience. The default density for components is 0, and increasing the density reduces the component height by four DPS. The scale can also be adjusted to ensure that the component is positioned as close to the text as possible.
To ensure that users can read the content of an interface, high component density interfaces should be designed to have a minimum touch target of 48 dp. The design should also consider line height and the space between lines of text.
Microvias
The latest developments in PCB technology are helping manufacturers increase the functionality of their products while using less space. The advancement in PCB technology is driven by the miniaturization of semiconductor packages and components. This allows manufacturers to offer more advanced features such as touch screen computing and 4G network communications. HDI PCBs feature multiple high-density interface layers and stacked microvias. Copper-filled stacked microvia structures are often seen in high-demand designs.
The microvias feature a two-level design, containing regular through-hole vias and buried vias. This design has multiple benefits, including reduced board layers and a lower cost. HDI also improves electrical performance, reducing the number of testing cycles needed to ensure reliable operation. This ultimately improves the reliability of the board and increases customer satisfaction.
PCB structure
A PCB is a circuit board of multiple layers and components arranged compactly. The layers are typical of varying thickness and can be as small as a few micrometers, but the goal is to minimize the overall size of the board. Its thickness and physical properties can characterize a PCB in many different ways.
A high-density interface PCB should adhere to a few important guidelines to minimize noise and maximize signal density. First, it should be constructed with proper layout and dimensions. A good rule of thumb for an HDI PCB is that the ground plane must be at least 20 times thicker than the power plane. Avoiding 90-degree bends, which can result in single reflections of frequencies, is also critical.
Cost savings
The high-density interface is a great way to reduce the cost of delivering high-quality Wi-Fi. The new TR Multicoax series features the highest density high-speed multi coax connector available in the market. In addition, the interface’s compression-mount construction eliminates expensive solder-down components and encourages reuse across programs.